1. 2. 3. material content data sheet sales product name idh05s120 issued 29. august 2013 ma# MA000622908 package pg-to220-2-1 weight* 1970.68 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material siliconcarbide 409-21-2 3.465 0.18 0.18 1758 1758 leadframe non noble metal iron 7439-89-6 1.343 0.07 681 inorganic material phosphorus 7723-14-0 0.403 0.02 204 non noble metal copper 7440-50-8 1341.263 68.06 68.15 680611 681496 wire non noble metal aluminium 7429-90-5 0.683 0.03 0.03 347 347 encapsulation organic material carbon black 1333-86-4 9.070 0.46 4602 plastics epoxy resin - 99.768 5.06 50626 inorganic material silicondioxide 60676-86-0 495.819 25.16 30.68 251598 306826 leadfinish non noble metal tin 7440-31-5 14.487 0.74 0.74 7351 7351 plating non noble metal nickel 7440-02-0 0.198 0.01 100 inorganic material phosphorus 7723-14-0 0.000 0.00 0.01 0 100 solder noble metal silver 7440-22-4 0.105 0.01 53 non noble metal tin 7440-31-5 0.084 0.00 42 non noble metal lead 7439-92-1 3.994 0.20 0.21 2027 2122 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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